Exhibit packages for Medical MEMS 2016 are available. For further information and questions about exhibiting, please click here.

ALLVIA provides silicon/glass interposer and through-silicon via (TSV) foundry services for semiconductor, optoelectronics and MEMS industries, meeting the demands of advanced vertical interconnects. With 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a leader in TSV development, provides design & processing for frontside (filled) and backside (conformal plated) through-silicon vias and offers services for prototyping as well as volume production runs.

Microelectronics assembly technologies including: advanced packaging and SMT assembly on PCB, PCB-FLEX and ceramic substrates. We support high complexity and small miniature assemblies from prototype to production. Our Silicon Valley facility includes 2,500 square feet cleanroom ISO 7 with on-site process development, engineering and manufacturing support. Advanced packaging: We support precision die attach and flip chip with DATACON 2200 EVO Plus; wire bond (Au ball, Au wedge, Al wedge) with KNS ICONN and H&K BJ820 and BJ815; and encapsulation with Glob Top, dam & fill and UV materials with ASYMTEK S820 with dispense jet and auger pumps. SMT assembly: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and connectors; PCB from 0.012” to 0.200”; PCB-FLEX from 0.004” to 0.010”; and ceramic 0.010” to 0.040” thickness.

Cicor Advanced Microelectronics & Substrates (AMS) offers you a broad range of state-of-the-art products and services. In the area of microelectronics, we can offer you the latest technologies in packaging, assembly and interconnection techniques. In the field of substrate manufacturing and processing, we are characterized by the production of highly complex rigid, flexible and rigid-flexible printed circuit boards and substrates using thin and thick film technology.

IMT offers the most complete MEMS foundry services in our fully automated 30,000 sq ft, 6” wafer fab. IMT’s extensive product experience includes DC and RF switching, drug discovery/delivery, microfluidics, cell sorting, inertial navigation, optotelecom, IR emitters, and others. IMT offers wafer bonding for both hermetic packaging/encapsulation and microfluidics including: fusion bonding, anodic bonding, glass frit bonding, Au-Au thermocompression bonding, metal alloy bonding and various types of polymer bonds. IMT’s wafer-level packaging and through silicon via technologies are production proven for the next generation 3D packaging and interposer applications. IMT is ISO 9001 certified offering complete turn-key foundry services from design through high-volume production. We bring our customers’ MEMS to volume production. Speak with an IMT representative to see how we can make your MEMS work for you.

Micralyne is a leading independent MEMS and microfabrication foundry. We excel at creating process technology for complex MEMS devices and execute disciplined volume manufacturing. Micralyne extends its value to our customers by offering extensive packaging, testing, and design services, beyond a typical MEMS chip foundry. This Foundry Plus model has successfully produced products for industries such as: life sciences, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities. Our fabrication services fit their need by providing established process platforms and timely device fabrication through early prototype, qualification, and volume manufacturing.

Nanolab Technologies provides comprehensive cutting edge technology for failure analysis, analytical microscopy, surface analysis and FIB circuit edit, and has broad capabilities in reverse engineering and device circuit extraction. We specialize in fast turn-around and customized interaction with our customers. Servicing the semiconductor, MEMS, solar, nanotechnology, defense, advanced packaging and other high technology markets, we are ISO 9001 and ITAR certified and maintain highly secure protocol with all our customers. Nanolab Technologies is headquartered in Milpitas, CA with other facilities in Plano, TX and Albany, NY.

Novati Technologies is the leading innovation partner for accelerating nanotechnology development and commercialization. Novati's proven advanced technology and secure IP infrastructure combined with our Technology Development Process supports companies developing MEMS, microfluidics, novel transistors, photonics and other nanotechnologies for the semiconductor, healthcare & life sciences and aerospace & defense markets. Novati provides customers with technology building blocks, engineering expertise, professional program management and a broad complement of flexible processing equipment that enable the accelerated development of 200mm and 300mm silicon-based solutions. Looking forward, the company continues to integrate advanced 3D wafer stacking and TSV processes from its parent company, Tezzaron® Semiconductor, the world leader in 3D-ICs, as well as advanced wafer bonding processes from license partner, Ziptronix, Inc. All work is performed at Novati's state-of-the-art, DMEA-accredited trusted foundry, ITAR-certified wafer fab in Austin, TX.

Neutronix-Quintel (NXQ) is a leading provider of high performance mask alignment systems since 1978. NXQ is comprised of a team of seasoned industry veterans with vast experience in photolithography, providing their customers with the most robust solutions which have been derived from many years of customer driven innovations. NXQ has well over 1000 systems installed around the world used for various technologies such as MEMS, compound semi, biomedical, microfluidics, HB LED, WLP, 3DIC / TSV, 2.5D interposer and HCPV. Prominent high volume manufacturing companies utilize NXQ’s equipment for end products such as transceiver chip sets for cell phones and other wireless devices, medical sensors, automobile sensors, LED lighting, military and defence electronics, IR detectors, optical devices used for communications and discrete devices. The company’s products are also used extensively throughout the world at universities and research institutes and are recognized as one of the most versatile and flexible mask aligners in the marketplace. NXQ works closely with customers to innovate and develop new features that differentiate their products from the competition. The company continues to gain market share with customers that require equipment suppliers who can meet their stringent needs for cost, performance and reliability. With the recently release of the 300mm platform, NXQ is well positioned to maintain double digit growth.

Rogue Valley Microdevices is a full-service precision MEMS foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. With commercially successful customers in microfluidics, lab-on-chip platforms and other biomedical devices, Rogue Valley Microdevices has the market-specific expertise to help bring your product to market — collaboratively, creatively and effectively. Beyond our MEMS fab, Rogue Valley also maintains the broadest and most comprehensive set of wafer services commercially available. Founded in 2003 and based in Medford, Oregon, Rogue Valley maintains a 200mm MEMS devices foundry. Visit us at Medical MEMS & Sensors 2016 to learn more about our design-to-manufacturing program for biomedical device companies. For more information, visit www.roguevalleymicro.com

Silex Microsystems is the world’s leading pure play MEMS foundry. Since our beginnings in 2000, Silex has been a dedicated manufacturer of customized MEMS products, operating as an independent MEMS foundry. We offer unparalleled processing power in the world’s first dedicated eight-inch pure play MEMS foundry fab. Our goal is to be the industry’s most advanced and efficient provider of MEMS foundry services. By leading the way in technology and offering truly cost effective manufacturing, we help customers take the full advantage of MEMS. Our superior knowledge of MEMS processing and our advanced production technology are key to serving our customers and contributing to their successful products.

Since 1974, Sonoscan®, the leader in acoustic microscopy (AM), has manufactured systems in the USA and regional support laboratories in Asia, Europe and the USA for AM services. Sonoscan's proprietary C-SAM® technologies have set the standard for over 40 years. Sonoscan provides non-destructive analysis for process control and quality assurance to safeguard your MEMS products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for front, mid and back-end microelectronics, including the AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMS devices in trays. Collaboration with Sonoscan customers and industries has led to many innovations, patents and standards over the years. Specific to the MEMS industry, transducers were developed and built by Sonoscan for bonded wafers, hermetic/cap seal, lab-on-chip and MEMS packaging inspection, plus automated accept/reject methods for die and cavity seal mapping of a wafer.

TECNISCO is a process service provider of precision components. We support design and manufacturing with our “cross-edge” microprocessing technology. In particular, our processing is used in the following fields: structured glass wafers for MEMS packaging; glass microfluidics for drug discovery and chemical reaction; customized heatsinks for laser diodes and LEDs. We can provide the 4 following advantages by undertaking several processes as a one-stop solution partner: 1. maintaining the stability of product quality, 2. shortening the lead time, 3. providing better cost-performance products and services and 4. solving customers’ problems by crossing our technologies and developing original products. About “cross-edge” microprocessing: TECNISCO’s original technologies provide the products which meet customers’ needs best from the viewpoint of quality, cost and productivity with combined technologies, crossing five processing technologies such as: cutting, grinding, polishing, metalizing, and bonding.

ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.

X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing devices on silicon wafers for mixed-signal integrated circuits (ICs), CMOS sensors and MEMS. X-FAB operates from five manufacturing locations in the USA, Germany and Malaysia offering wafer capacity of over 850,000 200mm-equivalent wafers per year. X-FAB maintains compliance to ISO standards for automotive and medical foundry manufacturing and all operations are ISO/TS 16949 certified. The largest specialty fab group, X-FAB is unlike typical foundry services because of its expertise in combining advanced analog and mixed-signal CMOS process technologies with MEMS, specialized materials and wafer-level bonding and packaging. CMOS processes include options for non-volatile memory, high-voltage and high temperature. MEMS and sensors technologies include pressure sensors, inertial sensors, microphones, gas sensors, CMOS image sensors and ambient light sensors.

Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.

Exhibit Opportunities

To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $1,495 and includes the following:

  • One (1) conference and reception admission
  • Printed conference program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed conference program and on printed conference signage
  • Company logo and description on event website
  • Company logo and description on event dedicated emails to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the medical, biotech, MEMS, sensors and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about exhibiting, please contact Jessica Ingram at jessica@memsjournal.com or call 360-929-0114.

Exhibit space is limited. Sign up today!

Past Exhibitors

Many thanks to our exhibitors from the 2013-2015 events.

acam provides intelligent ASIC solutions for MEMS sensors. The versatile solutions can be used with a variety of sensors (e.g. capacitive or resistive) and are well suited for portable medical devices thanks to the very low current consumption. The high resolution and measurement rate of the chips make them perfect for the use in high-end applications. The on-board processing capability in form of a microprocessor allows for compact sensor fusion, e.g. to make the linearization of a pressure sensor directly on chip.

acam is a privately owned company with its headquarter located in the south of Germany. A worldwide distributor network assures local support with offices in North America, Europe and Asia.

Advance Reproductions is a leading supplier of high-quality, large-area and optical photomasks and phototools. Advance is an ISO 9001and ITAR registered company. We support manufacturers throughout the world involved in the manufacturing of semiconductor, hybrid, microwave, nanotechnology, medical and electronic packaging devices. Advance Reproductions provides solutions and custom manufacturing services for research and development, custom shaped substrates and engineered tooling.

Allion is a leader in flexible and innovative product testing and validation. We have the expertise and infrastructure to tackle a wide range of technologies. Our real-world testing environments allow our clients to see how their product performs in the places their customers use it most. For other challenges, Allion engineers combine their technical skills and creativity to develop new testing methods that fit your product. We use resources such as our partnership with Cinder Solutions to build the necessary tools for all kinds of product validation. No matter what stage of the development process you are in, we’re ready to help.

Alpha Precision specializes in custom ultrasonic machining of wafers and high precision surface polishing for excellent anodic bonding for MEMS. The ultrasonic process results in high precision placement and tolerances of features on the MEMS wafer. Ultrasonic machining does not impart any substrate cracking, stress or temperature change. This process is applicable to many different brittle substrates such as glass and ceramic. End use features include through vias, cavities and grooves. ISO/TS 16949:2009 Certified Quality Process.

Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes.

Alston & Bird LLP has grown to become a national AmLaw 50 firm while remaining steeped in a culture with client service and teamwork as the cornerstones of all that we do. We develop, assemble and nurture the strongest and broadest array of legal talent and expertise necessary to meet our clients’ needs in an ever-changing and fast-paced environment.

Alston & Bird’s unique culture and core values have been nurtured for more than a century. They define who we are and how we interact with our clients and with each other. From the founding of the firm in the late 1800s, collegiality, teamwork, loyalty, diversity, individual satisfaction, fairness and professional development have been guiding principles and values by which we measure ourselves.

Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash. This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials. In addition, Boschman serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications. By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.

Diamond MT was founded in 2001 as a firm specializing in contract applications of Conformal Coatings for Department of Defense and Commercial Electronic Systems. Since our beginning, Diamond MT has established a reputation for providing the highest quality services in the industry. Our commitment to quality, integrity and customer satisfaction combined with an unmatched expertise in applications and processes has provided every one of our customers with superior results.

Diamond MT offers a highly skilled workforce, rapid turn around manufacturing and high reliability through an established quality program, along with experience of commercial manufacturing requirements, competitive pricing and on-time delivery.

Excelitas Technologies is a global technology leader focused on delivering innovative, customized optoelectronics and advanced electronic systems to a global customer base of leading OEMs seeking high-performance, market-driven technologies.

Finetech's precision die bonders provide sub-micron placement accuracy and process modularity within one platform: thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing. Ideal solutions for advanced technology applications: flip chip, laser bars & diodes, VCSELs, MEMs, sensors, detectors, 3D, W2W / C2W, photonics packaging, and micro-optics assembly.

The Greater Geneva Berne area is a Swiss economic development agency representing the interest of six Swiss cantons (states) in Western Switzerland: Berne, Fribourg, Geneva, Neuchatel, Valais and Vaud. Surrounded by France, Germany and Italy, our region offers a welcoming environment for companies to collaborate, develop and commercialize their technologies on an international scale. With our dense and sophisticated life science and microtechnology clusters representing nearly 5000 companies, more than 500 labs, and 120,000 workers, these sectors have converged to create an academic and commercial environment of international renown in the MEMS, sensors, and high-tech biomedical sectors.

Companies are drawn to our region because of the potential for synergies and close collaboration with our unique institutions such as the Swiss Federal Institute of Technology (EPFL) with 19 specialized labs in microtechnology, the Swiss Center for Electronics and Microtechnology (CSEM), the Swiss Foundation for Research in Microtechnology, our six cantonal universities, and our three University Hospitals of Berne, Geneva, and Lausanne.

Research is a top priority in Switzerland where more scientific publications and patents are filed per capita than anywhere else in the world. Our region's above average spending on fundamental and applied research is the result of long-standing policies and initiatives to attract investment and collaboration in high value-added sectors.

We offer an accessible regulatory environment; an open clinical community; low taxes; an educated, multilingual, multicultural workforce; science parks and incubators; networking platforms; state-funded collaboration programs; and a world-class quality of life.

As a government sponsored association, our mission is to provide support and assistance to companies (MEMS, sensors, life sciences, etc.) interested in the benefits that Switzerland can bring to them. Our support ranges from facilitating relationships with potential partners to helping negotiate the regulatory environment to all aspects of establishing an enterprise in Switzerland. For more information, please contact Matt Julian at 512-301-3337 (office), 512-586-7035 (cell) or m.julian@ggba-switzerland.ch (email).

Founded in 1984, Heidelberg Instruments is today a global leader in design, development and manufacturing of complex laser based maskless lithography systems. These systems are critical to fabrication of advanced photomasks and direct write solutions in the areas of Advanced Electronic Packaging, Flat Panel Display, MEMS, Integrated Optics and other micro and nano based applications.

Heidelberg Instruments’ customers include many of the major global nano and micro technology based corporations along with some of the leading research and development organizations that provide components used in an array of electronic, communication and information technology products.

Heidelberg Instruments is located in Heidelberg, Germany, with global customer support offices in Asia, Europe, and North America. The company is 100% privately owned by the management and employees.

Infinite Graphics Incorporated (www.IGI.com) is redefining precision quality imaging by solving phototooling challenges where size, substrate and dimension are unique. Stop by our booth to discuss your projects requiring incomparable quality photomasks, photolithography, 3D sculptured microstructures and sophisticated software editing, just to name a few. Featured products: photomasks services, 3D micro-structures, MLAs, software solutions - CAD CAM, imaged glass products.

Invenios designs, develops, and manufactures microfluidics, MEMS, and 3D microstructures. The company also engineers exclusive processes and custom production equipment that is required to manufacture this range of products. Invenios has a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for both established and emerging companies. Unlike traditional microsystems foundries, Invenios delivers a complete production cycle, which includes design review, process development, manufacturing, and testing within an ISO 9001 environment to support a broad range of micron and sub-micron level products.

Kent State University is internationally recognized for its biomedical research. Current research strengths across the many disciplines at Kent State are particularly compatible with the bioengineering fields of tissue regeneration, biomaterials, biocompatibility, sensors and implanted devices. Our researchers are developing transdermal implants for amputees, improving neural function with implanted electrodes, creating implanted sensors for monitoring blood chemistry and vital signs and designing drug delivery devices that can be implanted or worn on the skin. Our researchers are also developing new medical sensors using advanced organic and polymeric materials to measure biomarkers and other biochemical indicators of disease, injury and trauma. Other materials research focuses on improving the biocompatibility of materials, decreasing the risk of infection from implanted devices, producing Lab-on-a-Chip devices for diagnostic and therapeutic applications and creating a new generation of flexible electronic medical devices for implantation and other applications. Kent State is also known for its research strengths in flexible electronics and liquid crystals within its Liquid Crystal Institute™(LCI).

The Lurie Nanofabrication Facility (LNF) at the University of Michigan offers 24/7 semiconductor processing capabilities on production-level equipment supported by professional staff. We have advanced processing capabilities for MEMS, BioMEMS, microfluidics and much more. We provide training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.

Mager Scientific has provided sample preparation equipment and optical solutions to the fields of metallography, microscopy and electron microscopy since 1961. We are the authorized distributor of Leica Microsystems Nano Technology in the Midwest. This product line includes the EM CPD300 Critical Point Dryer.

Critical point drying is an important method used to clean, dry, and provide surface tension-free release of the delicate 3-D microstructures of MEMS devices. With the EM CPD300, Leica has fully automated the critical point drying process for Sol-Gels, Carbon Nanotubes, samples for SEM analysis, as well as for MEMS devices. Users of this instrument enjoy cost-saving efficiency via automation, reproducibility and ease of use.

Medical Main Street Network: a unique alliance of world-class hospitals, universities, and medical device and bio-pharma companies in Southeast Michigan. This concentration of top medical professionals creates a global center of innovation in health care, research and development, education, and commercialization in the life science industry. Oakland County is a major health care and life sciences powerhouse, employing more than 100,000 people—more than the Mayo and Cleveland Clinics combined. The region is a dynamic area to launch or expand a medical technology business, and Oakland County provides many resources to support a company’s success, including: Demographic data, Site location assistance, Financing options, Tax incentives, Introductions to state and local agencies, Workforce development, and Business consulting.

Medical Main Street - Maximizing the growth potential of the healthcare and life science sectors in Southeastern Michigan

At Medtronic, we're committed to Innovating for Life by pushing the boundaries of medical technology and changing the way the world treats chronic disease. To do that, we're thinking beyond products and beyond the status quo - to continually find more ways to help people live better, longer.

Nordson Corporation operates in more than 30 countries around the world delivering precision technology solutions to help customers succeed worldwide. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.

The National Nanotechnology Infrastructure Network (NNIN) is an integrated network of user facilities, supported by the National Science Foundation, serving the needs of nanoscale science, engineering and technology researchers across the country. The goal of the NNIN is to enable rapid advancement in science and engineering at the nanoscale by providing researchers with efficient access to nanotechnology infrastructure (fabrication, characterization and computational capabilities and facilities) and support from experienced staff members.

The Lurie Nanofabrication Facility (LNF) at the University of Michigan is one of the NNIN sites that offers 24/7 semiconductor processing capabilities on production-level equipment supported by a professional staff. With 1,160 m2 (12,500 ft2) of ISO class 4/5/6 and 7 (Class 10/100/1000 and 10,000) cleanrooms for processing pieces, 100 mm and 150 mm wafers, we have processing capabilities for silicon and organic devices, MEMs and bioMEMs, fluidics and biofluidics, and nanoimprint technologies.

With such an available suite of established technologies for a large range of applications, the LNF is ideal for rapid feasibility assessment of ideas and pilot/low-volume products. Whether you want to assess new process adjustments for your product without compromising your current process, explore new device directions, or simply take advantage of our advanced characterization capabilities, the LNF provides the complete cleanroom experience for your high tech needs. The LNF is also part of the National Nanotechnology Infrastructure Network (NNIN), an integrated network of user.

With over $20M in state-of-the-art equipment, we provide the training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.

Original Biomedical Implants, Inc. (OBI) was established in Texas with an initial focus of commercializing a new generation of dental drills and implants with a unique patented ultrananocrystalline diamond (UNCD) coating, which enables an order of magnitude superior performance over current products at competitive costs. After a return on investment (3 years), OBI will also commercialize high-revenue new generation medical devices such as MEMS drug delivery devices and biosensors, UNCD-coated prosthesis (e.g., hips, knees, stents), electrically conductive UNCD electrodes for neural stimulation, and much more. UNCD-based products will address the global health business which is projected to reach $365 billion per year in 2015 (Global Industry Analyst, February 2012).

When you need a custom MEMS device for your system, you can rely on our experts. Their expertise is to really understand your requirements, to show feasibility and proof of concept, develop the product and required process in a stage-gated manner and reproduce reliably and controlled.

As an innovation service provider, we want you to be successful in delivering innovations to the market, where they can matter to your customers and society as a whole. Our mission is simple: to accelerate the innovation of our customers, from start-up to multinational. Being globally active with more than 1,000 experts we can support innovation processes end-to-end, driving first-time-right designs and thus improving your time to market.

Picosun is a manufacturer of systems for the vacuum deposition of thin film materials by Atomic Layer Deposition (ALD). The ALD technique, by virtue of its controlled layer-by-layer atomic scale growth mechanism, can provide thin films that perfectly conform to nano-sized surface contours with precise control of film thickness and an exceptional degree of thickness uniformity. ALD has rapidly become a critical enabling technology for numerous application areas, and is currently poised to impact the MEMS and sensor markets. Picosun designs and builds ALD tools for both advanced R&D and pilot production, as well as for high volume manufacturing, and possesses a team of specialists and experts with experience dating from the inception of the ALD technique. Picosun has its main headquarters and factory in Espoo, Finland, regional offices in Detroit and Singapore, and and sales and service representatives in more than 20 countries worldwide.

Quik-Pak provides IC packaging and assembly services to the semiconductor, telecom, RF wireless, and medical markets. The company offers both custom open-molded plastic packages, and pre-molded plastic packages (OmPP.) Quik-Pak’s pre-molded plastic packages are cost-effective, come in a wide variety of sizes and lead counts, are available off the shelf, and are ideal for prototype or production volume applications. Quik-Pak also specializes in a variety of services that together provide a full turn-key packaging and assembly solution including wafer preparation, die/wire bonding, encapsulation and marking/branding - all under one roof. Custom assembly services are also offered for flip chip, ceramic packages, chip-on-board, stacked die, MEMS, etc.

At RBB Systems, we specialize in on-demand manufacturing of mission-critical electronic assemblies for the industrial, commercial, medical and military sectors. By embracing small batch custom assemblies of electronic circuit boards, we allow clients greater flexibility in meeting fluctuating market demands.

We combine the best lean manufacturing principles with a hungry can-do attitude. Our cost-effective, team-driven approach offers a meaningful alternative to offshore production. Our organizational mission is simple: We exist to move heaven and earth to get our small batch customers what they need, when they need it.

If you need low-volume printed circuit board assembly to support second-tier product lines or other small batch industrial electronics work, we invite you to contact us to learn more about our services, philosophies and capabilities.

Robson Technologies, Inc. (RTI), established in 1985, is a solutions based provider of customizable test sockets, test fixtures, automated curve tracing test equipment, and other high performance interfaces catered to the MEMS, semiconductor, medical, military, automotive, and other electronics test markets. RTI works with your team from prototype through production to produce a comprehensive and integrated hardware solution that bridges the gap between your device under test and your test or measurement system. RTI is an employee owned company located just south of Silicon Valley in Morgan Hill, California and all products are all built to order in-house via mechanical/PCB design, a high capacity machine shop, and product assembly/QA. Call on RTI to discuss your next test project and learn how you can benefit from a tailored test solution today!

Rogue Valley Microdevices is a full-service precision MEMS foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. Specializing in MEMS and biomedical device manufacturing, Rogue Valley offers a flexible equipment set and smaller batch sizes, playing a critical role in the commercial MEMS manufacturing ecosystem.

At Rogue Valley, we engage in open dialog with our customers, prioritizing your goals and needs every step of the way. We also share engineering-level data with customers, so you can bring up a process at Rogue Valley that you will later use for high-volume production at a larger fab.

Beyond our MEMS fab, Rogue Valley also maintains the broadest and most comprehensive set of wafer services commercially available.

Founded in 2003 and based in Medford, Oregon, Rogue Valley maintains a 200mm MEMS devices foundry. For more information, please visit: www.roguevalleymicro.com.

Semefab is a volume foundry supporting an extensive process portfolio of MEMS, MOS, bipolar, opto-CMOS, ASIC and discrete technologies and supplies silicon wafers, die and packaged devices to the market. Semefab operates its own 6-inch and 4-inch volume foundries with complete autonomy between its MEMS and MOS/bipolar fabs.

Semefab also supports wafer and package test in its facilities. Supporting a commercialization business model, Semefab optimizes device structures and process flows within an ISO accredited environment and seamlessly transfers these into its volume foundries. As a global foundry, Semefab exports more than 74% of its fabricated product and ships more than 200 million die per year.

Sensirion is the leading manufacturer of high-quality sensors and sensor solutions for the measurement and control of humidity, and of gas and liquid flows. Millions of Sensirion's sensor components and solutions are used all over the world, including in the automotive industry, medical technology, building technology, industrial processes, and in consumer goods. Sensirion's success is based on the innovative CMOSens® technology, which combines the sensor and analysis electronics in a single semiconductor chip. Sites all around the world and a seamless distribution network mean we can be local to any customer anywhere in the world in order to provide the best possible support at every stage of the project.

Silex Microsystems is the world’s leading pure play MEMS foundry. Since our beginnings in 2000, Silex has been a dedicated manufacturer of customized MEMS products, operating as an independent MEMS foundry. We offer unparalleled processing power in the world’s first dedicated eight-inch pure play MEMS foundry fab. Our goal is to be the industry’s most advanced and efficient provider of MEMS foundry services. By leading the way in technology and offering truly cost effective manufacturing, we help customers take the full advantage of MEMS. Our superior knowledge of MEMS processing and our advanced production technology are key to serving our customers and contributing to their successful products.

Silicon Microstructures, Inc. (SMI) is a premier developer and manufacturer of MEMS-based pressure sensors for a range of markets, with years of experience and expertise in low-pressure and harsh environment products that meet today’s stringent requirements for medical, automotive and industrial safety. SMI's design, production and quality control processes have enabled it to develop both the lowest pressure and smallest pressure sensors available on the market today.

Since 1986, Sonix has pioneered many of the breakthroughs in image accuracy and process productivity that have helped wafer and chip manufacturers literally transform the world. Where others have failed, we have consistently found the right answers to very difficult problems. Today, Sonix acoustic scanning microscopes are used by leading manufacturers worldwide to perform nondestructive inspection of bonded wafers and packaged semiconductors, from the development lab to the production floor. These industry-leading systems deliver the high-resolution images and advanced diagnostic tools that semiconductor designers and fabricators need to verify reliability, qualify new designs, monitor production, pinpoint device failures and improve process control. Technology innovation and leadership are at our core. We make substantial R&D; investments, discovering what the future will require and developing novel solutions to meet evolving market demands. We collaborate with our customers to address today’s needs and tomorrow’s innovations as a team. Clearer diagnostic imaging, greater analytic control, faster throughput and more responsive service and support—that’s the Sonix difference.

TECNISCO is process service provider of precision components. Since established, we've expanded the technical process field and generated "cross-edge" micro processing which means cross over the 5 (cutting, grinding, polishing, metallizing, and bonding) cutting edge technologies for supporting in the field of opto-telecommunication, industrial lasers and MEMS devices for medical industries. We are able to supply customized parts manufactured with metal, ceramic, glass and silicon by its advanced high-precision processes and composite technologies.

TECNISCO's expertise includes: dicing, sandblasting, milling (CNC machining), assembling, polishing, bonding, metallization for producing such as heatsinks and structured glass wafer (for MEMS and medical devices).

Tronics is an international full-service MEMS manufacturer with wafer fabs in Europe and the USA, offering one of the broadest portfolios of MEMS processes in the industry. Fast prototype turnaround, high volume manufacturing, comprehensive test and packaging capabilities – Tronics delivers MEMS, from tested wafers to integrated custom components. Tronics engineering support includes electronic interface development, assembly and custom packaging. Tronics is "much more than a MEMS foundry" in the sense that it offers the full service spectrum required for successful transformation of OEM concepts into reliable MEMS products, such as accelerometers, gyros, pressure sensors, switches, mirrors, or bioMEMS.

Tousimis manufactures highly reliable Supercritical CO2 Dryers. Our Critical Point Dryer (CPD) process technology eliminates surface tension forces enabling delicate 3-D micro structure preservation.

Current CPD applications include Biological, MEMS, Bio-MEMS, Aero Gel, Nano Particle, Carbon Nanotube, Graphene and others.

Tousimis also manufactures high purity fixatives and X-Ray Reference standards.

Tousimis is a USA based company supported via a global sales and service network.

Tystar is a service and solutions oriented equipment supplier to the semiconductor, MEMS and nanotechnology industries, offering a full range of diffusion, oxidation, LPCVD furnace systems as well as customer-specific specialty equipment. Tystar provides full equipment, process and application support. With over 1600 tubes operational around the world, Tystar maintains a global presence. Our products are accepted throughout the industry for their small foot print, high quality, reliability, efficiency and value. Additionally, Tystar has earned the reputation of offering outstanding customer service and support.

UBOTIC Company Limited provides advanced MEMS/sensor and specialty semiconductor prototype to production assembly with a focus on low cost open-tool and custom package design and fabrication. We provide package, lead-frame and substrate design along with fabrication of molded air cavity QFN package (AQFN), LGA cavity, over-molded QFN, SOIC cavity, stacked-die, ceramic, and custom SIP. Additional services include both thermal and electrical modeling along with package qualification and reliability testing. The factory is certified in TS16949:2009 and ISO9001-2008.

Biomedical Engineering at The University of Akron is both patient-centered as well as student-focused. We seek to find solutions to pressing needs of the medical community, and we expect our students to be at the forefront of medical innovation. Within our department, we focus on three areas of specialization: Biomechanics, Biomaterials & Tissue Engineering, and Instrumentation, Signals & Imaging. Through these areas we strive to (i) better understand mechanisms of disease, (ii) develop improved technologies for diagnosing or treating diseases, and (iii) educate the next generation of biomedical engineers. Knowledge gained through this approach fuels the rapid expansion of our region’s biomedical sector.

The University of Louisville's Micro/Nano Technology Center (MNTC) is a recognized Small Times magazine top 10 multi-user core facility open for business to external businesses and academic institutions. The MNTC consists of a state-of-the-art class 100/1000 10,000 ft2 cleanroom facility, a 900 ft2 core lab for device packaging/testing and a 300 ft2 software lab dedicated to MEMS (microelectromechanical systems), microelectronic and optical device modeling/simulation. This $30M facility has over 100 available tools and gives students and researchers the capabilities to design, model, fabricate and test. We invite you to use our facility to help further your research.

Valtronic innovates and manufactures miniaturized electronic products for trusted medical device partners. Valtronic’s customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years, Valtronic has helped thousands of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies from their worldwide facilities from Switzerland, the USA and Morocco.

X-FAB MEMS Foundry offers unsurpassed experience, expertise and execution with its high-volume MEMS manufacturing service and is a long-term, trusted supplier to the medical, life-science and automotive markets.The company draws on more than 20 years of contract manufacturing experience and continues to meet the new demands for this rapidly expanding group of technologies in terms of time to market, quality assurance, high yield and supply-chain management tools.

Medical devices were the first MEMS manufactured by X-FAB in 1996 and those same devices are still being delivered today. In the meantime, more than 50% of X-FAB’s shipped MEMS device are quality-critical parts for medical, biotech and automotive markets.

Operating from five fabs for MEMS and CMOS processes and an ecosystem of manufacturing and design partners, X-FAB is a proven choice for MEMS process development and installation, design support, process capability and long-term manufacturing stability. As well as customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP for analog/mixed signal, high voltage and power CMOS applications as well as key MEMS types such a pressure and inertial sensors that enable our customers to have the fastest time to market in the MEMS foundry industry.

Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. We manufacture high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens. Proven applications using these systems include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. YES has proven to withstand the test of time with products that increase yields, extend performance, and improve processes. All equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service. Visit us during the show at Booth #9.